Title:
METAL FOIL LAMINATE
Document Type and Number:
WIPO Patent Application WO/2014/171345
Kind Code:
A1
Abstract:
To attain simultaneously the prevention of a tip from sinking into a substrate film layer in bonding the tip to metal wiring (namely mountability) and properties which have a trade-off relationship therewith, namely, flex resistance, folding endurance, pliability, and reduction in spring back which is seen as a problem in mounting a circuit board in a bent state or the like. A metal foil laminate composed of a metal foil and a substrate film which is made of a heat-resistant resin composition that comprises a polyimide-based resin crosslinked with an epoxy resin and which is laminated on at least one surface of the metal foil, characterized by satisfying the requirements (a) and (b): (a) when the total amount of the polyimide-based resin and the epoxy resin is taken as 100 mass%, the amount of the epoxy resin is 0.1 to 10 mass%; and (b) the insoluble matter rate of a base film which has been prepared by removing the metal foil from the metal foil laminate is 40% or more as determined by adding N-methyl-2-pyrrolidone to the base film in such an amount as to adjust the base film concentration to 0.5 mass% and heating the resulting mixture at 100ºC for 2 hours.
Inventors:
TADA KENTA (JP)
KURITA TOMOHARU (JP)
KURITA TOMOHARU (JP)
Application Number:
PCT/JP2014/059846
Publication Date:
October 23, 2014
Filing Date:
April 03, 2014
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B15/088; B32B15/08; C08G59/40; C08G73/14; C08L63/00; C08L79/08; H05K1/03
Foreign References:
| JP2001203467A | 2001-07-27 | |||
| JPH11240107A | 1999-09-07 | |||
| JP2007091799A | 2007-04-12 | |||
| JP2009270054A | 2009-11-19 | |||
| JP2011184508A | 2011-09-22 | |||
| JP2009147289A | 2009-07-02 |
Download PDF: