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Title:
METAL FOIL, METHOD FOR PRODUCING SAME, INSULATING SUBSTRATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2010/093009
Kind Code:
A1
Abstract:
Disclosed is a surface-treated metal foil which can be produced at low cost and enables easy formation of an extremely thin electroless plated copper foil, which does not require a sputtering process for forming a fine circuit and is capable of maintaining high adhesion strength, on a substrate surface.  The surface-treated metal foil can provide a replica having a uniform roughening shape with an anchoring effect. Specifically disclosed is a surface-treated metal foil, wherein a roughening bump plating is formed on at least one surface of an untreated metal foil using a burnt plating, and the roughening bump plating is subjected to capsule plating.  The surface-treated metal foil has a surface roughness (Rz) of 1.0-2.5 μm.  The roughening bumps formed in the roughening bump plating have a columnar shape with an interval of not less than 0.1 μm but not more than 1.0 μm between adjacent roughening bumps.  The surface-treated metal foil is most suited for the use as a replica.  The surface-treated metal foil is preferably a copper foil.

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Inventors:
OGURO, Ryoichi (2-3, Marunouchi 2-chom, Chiyoda-ku Tokyo 22, 〒1008322, JP)
小黒　了一 (〒22 東京都千代田区丸の内２丁目２番３号　古河電気工業株式会社内 Tokyo, 〒1008322, JP)
Application Number:
JP2010/052056
Publication Date:
August 19, 2010
Filing Date:
February 12, 2010
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO., LTD. (2-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 22, 〒1008322, JP)
古河電気工業株式会社 (〒22 東京都千代田区丸の内２丁目２番３号 Tokyo, 〒1008322, JP)
OGURO, Ryoichi (2-3, Marunouchi 2-chom, Chiyoda-ku Tokyo 22, 〒1008322, JP)
International Classes:
C25D7/06; C25D3/38; H01B5/02; H01B13/00; H05K1/09
Attorney, Agent or Firm:
SATOH, Takahisa (Sohshin International Patent Office, Toranomon Denki Building 2F 8-1, Toranomon 2-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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