Title:
METAL FRAME, PSEUDO-WAFER, SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/208756
Kind Code:
A1
Abstract:
A metal frame used in a pseudo-wafer in which chip-like semiconductor elements and a rewiring layer are integrated, wherein a lattice structure is formed with a frame in which are provided a plurality of openings in which the chip-like semiconductor elements are disposed, the frame comprising portions between adjacent openings, and among the frames forming the lattice structure, the frame disposed in the dicing area of the pseudo-wafer is configured so as to be discontinuously arranged.
Inventors:
UMEZAWA JO (JP)
Application Number:
PCT/JP2017/017724
Publication Date:
December 07, 2017
Filing Date:
May 10, 2017
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L23/12; H01L21/301; H01L21/56
Foreign References:
| JP2001308116A | 2001-11-02 | |||
| JP2015076604A | 2015-04-20 | |||
| JP2011181740A | 2011-09-15 | |||
| JP2001127088A | 2001-05-11 |
Attorney, Agent or Firm:
YAMAMOTO Takahisa et al. (JP)
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