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Patent Searching and Data


Title:
METAL JOINING MATERIAL, PRODUCTION METHOD FOR SAME, AND METHOD FOR PRODUCING METAL JOINED BODY USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/208554
Kind Code:
A1
Abstract:
Provided are: a metal joining material which has good oxidation resistance and exhibits good joining strength; a production method for the metal joining material; and a method for producing a metal joined body using the metal joining material. To this end, this metal joining material is characterized by containing: copper nanoparticles which are aggregates of a plurality of monocrystals having a particle size of 0.1-10 nm, and have a copper oxide layer containing copper oxide on the surface; and an organic solvent which has a boiling point of 200-250ºC and has a chain structure terminated with an hydroxyl group. In order to produce the same, a precursor dissolving step, a copper generation step, a copper oxide layer formation step, a separation step and a mixing step are performed. Additionally, in order to produce a metal joined body using the metal joining material, a coating step, a contacting step and a joining step are performed.

Inventors:
MORITA TOSHIAKI (JP)
YASUDA YUSUKE (JP)
NOGAWA TAKASHI (JP)
Application Number:
PCT/JP2017/009137
Publication Date:
December 07, 2017
Filing Date:
March 08, 2017
Export Citation:
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Assignee:
HITACHI LTD (JP)
International Classes:
B22F1/054; B22F1/107; B22F1/145; B22F1/16; B22F7/08; B22F9/24; B82Y30/00; B82Y40/00; H01B1/22; H01B13/00
Domestic Patent References:
WO2013061527A12013-05-02
WO2012173187A12012-12-20
Foreign References:
JP2013136840A2013-07-11
Other References:
See also references of EP 3466564A4
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)
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