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Title:
METAL LAMINATE, METHOD FOR PRODUCING SAME AND METHOD FOR PRODUCING PRINTED BOARD
Document Type and Number:
WIPO Patent Application WO/2018/043683
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a metal laminate which is able to achieve sufficient bonding strength between an insulating layer and a bonding layer and between the bonding layer and a conductive layer, while ensuring excellent electrical characteristics; a method for producing this metal laminate; and a method for producing a printed board. A metal laminate 1 which comprises an insulating layer 10, a bonding layer 12 and a conductive layer 14, and wherein: the insulating layer 12 contains a resin powder 16 containing a fluororesin; the resin powder 16 contains particles (A) 16a having particle diameters of 10 μm or more but does not contain particles having particle diameters that exceed the total thickness of the insulating layer 10 and the bonding layer 12; and a surface 10a of the insulating layer 10 has a surface roughness of 0.5-3.0 μm, said surface 10a being provided with the bonding layer 12. A method for producing this metal laminate 1; and a method for producing a printed board which uses this metal laminate 1.

Inventors:
TERADA Tatsuya (Limited 5-1, Marunouchi 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
HOSODA Tomoya (Limited 5-1, Marunouchi 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
Application Number:
JP2017/031472
Publication Date:
March 08, 2018
Filing Date:
August 31, 2017
Export Citation:
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Assignee:
ASAHI GLASS COMPANY, LIMITED (5-1 Marunouchi 1-chome, Chiyoda-ku Tokyo, 05, 〒1008405, JP)
International Classes:
H05K1/03; B32B15/08; B32B15/088; C08J5/00; H05K3/38
Domestic Patent References:
WO2012132691A12012-10-04
WO2016017801A12016-02-04
Foreign References:
JP2011177929A2011-09-15
JP2005324394A2005-11-24
Attorney, Agent or Firm:
SENMYO Kenji et al. (3rd Floor, PMO Kanda-Tsukasamachi 2-8-1, Kanda-Tsukasamachi, Chiyoda-k, Tokyo 48, 〒1010048, JP)
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