Title:
METAL LAMINATE
Document Type and Number:
WIPO Patent Application WO/2007/114081
Kind Code:
A1
Abstract:
Disclosed is an adhesive for metal laminates which has excellent heat resistance and desmear property and enables to bond a polymer film substrate and a metal foil at a low temperature. Also disclosed is a metal laminate using such an adhesive. Specifically disclosed is an adhesive used for bonding the substrate and the metal foil of a metal laminate comprising a polymer film substrate and a metal foil. This adhesive contains a polyimide having a glass transition temperature of not more than 200˚C, which is obtained by reacting a diamine component (A1) containing not less than 5 mol% but less than 20 mol% of a compound represented by the general formula (1) below with a tetracarboxylic acid dianhydride component (A2), and an epoxy resin (B). (1) (In the formula, n represents an integer of 1-50, Y represents an alkylene group having 2-10 carbon atoms, and when n is not less than 2, Y's may represent the same or different groups.)
Inventors:
KODAMA YOUICHI
Application Number:
PCT/JP2007/056070
Publication Date:
October 11, 2007
Filing Date:
March 23, 2007
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
KODAMA YOUICHI
KODAMA YOUICHI
International Classes:
C09J179/08; B32B15/088; C09J163/00
Foreign References:
| JP2005330300A | 2005-12-02 | |||
| JP2005194442A | 2005-07-21 | |||
| JP2004269622A | 2004-09-30 | |||
| JP2004155943A | 2004-06-03 | |||
| JP2006321930A | 2006-11-30 |
Attorney, Agent or Firm:
WASHIDA, Kimihito (Shintoshicenter Bldg.24-1, Tsurumaki 1-chom, Tama-shi Tokyo 34, JP)
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