METAL LAMINATED SUBSTRATE FOR USE AS AN OXIDE SUPERCONDUCTING WIRE MATERIAL, AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2011/007527

A1

Provided are a metal laminated substrate for use as an oxide superconducting wire material, and a manufacturing method therefor, whereby copper is oriented to a high degree and formation of surface scratches and grooves can be prevented. The provided manufacturing method comprises: a step in which the surface of copper foil which has been rolled to a rolling reduction of at least 90% is spatter-etched, with the temperature held below a crystal orientation temperature, and then surface adsorbates are removed; a step in which the surface of a nonmagnetic metal sheet is spatter-etched and surface adsorbates are removed; a step in which the copper foil and the metal sheet are bonded by the application of 300 to 1500 MPa of pressure from a mill roll; a step in which the bonded laminate is heated to at least the crystal orientation temperature of copper and the copper is crystal-oriented; and a step in which the copper surface of the laminate is coated with a protective layer.

OKAYAMA, Hironao (LTD. Technical Research Laboratory 1296-1 Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
岡山浩直 (〒11 山口県下松市東豊井１２９６番地の１東洋鋼鈑株式会社　技術研究所内 Yamaguchi, 〒7448611, JP)
KUROKAWA, Teppei (LTD. Technical Research Laboratory 1296-1 Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
黒川哲平 (〒11 山口県下松市東豊井１２９６番地の１東洋鋼鈑株式会社　技術研究所内 Yamaguchi, 〒7448611, JP)
NANBU, Kouji (LTD. Technical Research Laboratory 1296-1 Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
南部光司 (〒11 山口県下松市東豊井１２９６番地の１東洋鋼鈑株式会社　技術研究所内 Yamaguchi, 〒7448611, JP)
ISOBE, Yoshihiko (LTD. Technical Research Laboratory 1296-1 Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
礒部剛彦 (〒11 山口県下松市東豊井１２９６番地の１東洋鋼鈑株式会社　技術研究所内 Yamaguchi, 〒7448611, JP)
KOSHIRO, Takashi (LTD. Technical Research Laboratory 1296-1 Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
神代貴史 (〒11 山口県下松市東豊井１２９６番地の１東洋鋼鈑株式会社　技術研究所内 Yamaguchi, 〒7448611, JP)

JP2010/004460

January 20, 2011

July 08, 2010

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TOYO KOHAN CO., LTD. (2-12, Yonbancho Chiyoda-k, Tokyo 47, 〒1028447, JP)
東洋鋼鈑株式会社 (〒47 東京都千代田区四番町２番地１２ Tokyo, 〒1028447, JP)
SUMITOMO ELECTRIC INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
住友電気工業株式会社 (〒41 大阪府大阪市中央区北浜四丁目５番３３号 Osaka, 〒5410041, JP)
OKAYAMA, Hironao (LTD. Technical Research Laboratory 1296-1 Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
岡山浩直 (〒11 山口県下松市東豊井１２９６番地の１東洋鋼鈑株式会社　技術研究所内 Yamaguchi, 〒7448611, JP)
KUROKAWA, Teppei (LTD. Technical Research Laboratory 1296-1 Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
黒川哲平 (〒11 山口県下松市東豊井１２９６番地の１東洋鋼鈑株式会社　技術研究所内 Yamaguchi, 〒7448611, JP)
NANBU, Kouji (LTD. Technical Research Laboratory 1296-1 Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
南部光司 (〒11 山口県下松市東豊井１２９６番地の１東洋鋼鈑株式会社　技術研究所内 Yamaguchi, 〒7448611, JP)
ISOBE, Yoshihiko (LTD. Technical Research Laboratory 1296-1 Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
礒部剛彦 (〒11 山口県下松市東豊井１２９６番地の１東洋鋼鈑株式会社　技術研究所内 Yamaguchi, 〒7448611, JP)

H01B13/00; B23K20/04; C01G1/00; C22F1/08; C23F4/00; C22C9/00; C22C9/02; C22C9/04; C22F1/00; H01B12/06

OHTA PATENT OFFICE (New State Manor 356, 23-1 Yoyogi 2-chome, Shibuya-k, Tokyo 53, 〒1510053, JP)

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