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Title:
METAL MATERIAL AND CONNECTION TERMINAL
Document Type and Number:
WIPO Patent Application WO/2020/195058
Kind Code:
A1
Abstract:
Provided are a metal material and a connection terminal, the metal material being capable of suppressing an increase in the friction coefficient on the surface of a Sn-containing metal layer even without using Ag. This metal material 1 has a base material 15 and a surface layer 10 with which the surface of base material 15 is covered, wherein the surface layer 10 contains Sn and In, and at least In is present on the outermost surface thereof. In addition, this connection terminal is composed of said metal material 1, and the surface layer 10 is formed on the surface of the base material 15, in at least a contact section making electrical contact with the counterpart conductive member.

Inventors:
KUMONDAI MITSUHIRO (JP)
SAKA YOSHIFUMI (JP)
MIZUTANI RYOTA (JP)
Application Number:
PCT/JP2020/002018
Publication Date:
October 01, 2020
Filing Date:
January 22, 2020
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
C23C30/00; B32B15/01; C25D5/10; C25D5/50; C25D7/00; H01R13/03
Foreign References:
JPH08176883A1996-07-09
JP2002317295A2002-10-31
JP2010280955A2010-12-16
JPH11279791A1999-10-12
JP2003163135A2003-06-06
JP2014025093A2014-02-06
Attorney, Agent or Firm:
WENO & PARTNERS (JP)
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