Title:
METAL MATERIAL AND ELECTRONIC COMPONENT IN WHICH SAME IS USED
Document Type and Number:
WIPO Patent Application WO/2016/038965
Kind Code:
A1
Abstract:
Provided are a metal material with which the filling rate can be increased, and residual stress within a sintered compact can be reduced; and an electronic component in which said material can be used. This metal material (10) is characterized by comprising multiple types of metal particles (1), (2), the composition and particle diameter of each type of metal particles (1), (2) being adjusted such that their melting points are approximately the same. Because the present invention allows a high filling rate to be obtained, and the melting points of each type of metal particle to be made approximately the same, each type of metal particle can be melted evenly, and residual stress within a sintered compact can be effectively reduced to an unprecedented degree.
Inventors:
ADACHI EIKI (JP)
Application Number:
PCT/JP2015/067813
Publication Date:
March 17, 2016
Filing Date:
June 22, 2015
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
B22F1/00; C22C5/02; C22C5/06
Foreign References:
| JP2012179624A | 2012-09-20 | |||
| JP2011146193A | 2011-07-28 | |||
| JP2009295965A | 2009-12-17 | |||
| JP2012224885A | 2012-11-15 | |||
| JP2010229544A | 2010-10-14 | |||
| JP2010084199A | 2010-04-15 |
Other References:
TOSHIHIRO TANAKA ET AL.: "Thermodynamic Evaluation of Binary Phase Diagrams of Small Particle Systems", ZEITSCHRIFT FUR METALLKUNDE, vol. 92, no. 5, May 2001 (2001-05-01), pages 467 - 472
Attorney, Agent or Firm:
AOKI, Hiroyoshi et al. (JP)
Hiroyoshi Aoki (JP)
Hiroyoshi Aoki (JP)
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