Title:
METAL MATERIAL FOR ELECTRONIC COMPONENTS, METHOD FOR PRODUCING SAME, CONNECTOR TERMINAL USING SAME, CONNECTOR AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/017238
Kind Code:
A1
Abstract:
Provided are: a metal material for electronic components, which has low occurrence of whiskers, low adhesive wear properties and high durability; a connector terminal which uses the metal material for electronic components; a connector; and an electronic component. This metal material for electronic components is provided with: a base; a lower layer that is formed on the base and configured from one or more constituent elements selected from the constituent element A group consisting of Ni, Cr, Mn, Fe, Co and Cu; an intermediate layer that is formed on the lower layer and configured from one or more constituent elements selected from the constituent element A group and one or two constituent elements selected from the constituent element B group consisting of Sn and In; and an upper layer that is formed on the intermediate layer and configured from an alloy of one or two constituent elements selected from the constituent element B group and one or more constituent elements selected from the constituent element C group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir. The lower layer has a thickness of 0.05 μm or more but less than 5.00 μm; the intermediate layer has a thickness of 0.01 μm or more but less than 0.40 μm; and the upper layer has a thickness of 0.02 μm or more but less than 1.00 μm.
Inventors:
SHIBUYA YOSHITAKA (JP)
FUKAMACHI KAZUHIKO (JP)
KODAMA ATSUSHI (JP)
FUKAMACHI KAZUHIKO (JP)
KODAMA ATSUSHI (JP)
Application Number:
PCT/JP2013/067417
Publication Date:
January 30, 2014
Filing Date:
June 25, 2013
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C23C30/00; C22C5/06; C22C13/00; C22C19/03; C23C28/00; C25D5/10; C25D7/00; H01B1/02; H01B5/02
Foreign References:
| JP2012036436A | 2012-02-23 | |||
| JP2010138452A | 2010-06-24 | |||
| JP2011026677A | 2011-02-10 | |||
| JP2005353542A | 2005-12-22 | |||
| JPH11350189A | 1999-12-21 | |||
| JP2010262861A | 2010-11-18 | |||
| JPH05311495A | 1993-11-22 | |||
| JPH04370613A | 1992-12-24 | |||
| JPH11350189A | 1999-12-21 | |||
| JP2005126763A | 2005-05-19 |
Other References:
See also references of EP 2878704A4
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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