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Title:
METAL MATERIAL FOR USE IN ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2014/054190
Kind Code:
A1
Abstract:
Provided are: a metal material for use in an electronic component and having low insertion/removal resistance, low whisker occurrence, and high durability; and a method for producing the same. A metal material (10) for use in an electronic component and equipped with a substrate (11), an A-layer (14) for configuring the outermost layer of the substrate (11), and formed from Sn, In, or an alloy of these elements, and a B-layer (13) for configuring an intermediate layer provided between the substrate (11) and the A-layer (14), and formed from Ag, Au, Pt, Pd, Ru, Rh, Os, Ir, or an alloy of these elements, wherein the thickness of the outermost layer (A-layer) (14) is greater than 0.2μm, and the thickness of the intermediate layer (B-layer) (13) is 0.001μm or more.

Inventors:
SHIBUYA YOSHITAKA (JP)
FUKAMACHI KAZUHIKO (JP)
KODAMA ATSUSHI (JP)
Application Number:
JP2012/078202
Publication Date:
April 10, 2014
Filing Date:
October 31, 2012
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C23C30/00; C22C5/06; C22C5/08; C22C9/00; C22C9/02; C22C9/04; C22C13/00; C22C13/02; C22C19/03; C22C19/05; C25D3/02; C25D3/12; C25D7/00; H01B5/02; H01R13/03
Foreign References:
JPH11229178A1999-08-24
JP2003129278A2003-05-08
JP2004190065A2004-07-08
JPS61124597A1986-06-12
JPH01306574A1989-12-11
JPH02301573A1990-12-13
JPH0978287A1997-03-25
JP2003129278A2003-05-08
JP2011122234A2011-06-23
Other References:
See also references of EP 2905357A4
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
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