Title:
METAL MEMBER-EQUIPPED SUBSTRATE, CIRCUIT STRUCTURE, AND ELECTRICAL CONNECTION BOX
Document Type and Number:
WIPO Patent Application WO/2018/193828
Kind Code:
A1
Abstract:
A metal member-equipped substrate 21 is provided with: an insulated substrate 22 which has formed therein a substrate through-hole 25 and an electrically-conducting path 24 formed in an insulation plate 23; a bus bar 28 which is stacked on the insulated substrate 22 and which has formed therein a bus bar through-hole 29 contiguous to the substrate through-hole 25; a metal member 30 which has a shaft part 31 and a first head part 32 having a diameter larger than that of the shaft part 31; and a conductive joining member 35 which, while one of the shaft part 31 and the first head part 32 is kept inserted in the substrate through-hole 25, joins the inner wall of the substrate through-hole 25 with said one of the shaft part 31 and the first head part 32, wherein the other of the shaft part 31 and the first head part 32 is fixed to the bus bar 28 while being kept inserted in the bus bar through-hole 29.
Inventors:
UCHIDA KOKI (JP)
KITA YUKINORI (JP)
KITA YUKINORI (JP)
Application Number:
PCT/JP2018/014205
Publication Date:
October 25, 2018
Filing Date:
April 03, 2018
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K1/14; H01R4/58; H02G3/16; H05K1/02; H05K3/36
Foreign References:
| JP2015053786A | 2015-03-19 | |||
| JP2009176996A | 2009-08-06 | |||
| JP2013004953A | 2013-01-07 | |||
| JPH08222671A | 1996-08-30 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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