METAL MOLD ASSEMBLY FOR OPTICAL PART AND METHOD OF SETUP THEREFOR

WIPO Patent Application WO/2008/029653

A1

A metal mold assembly that is adapted to clamp fixed mold (27) and movable mold (28) together while making temperature adjustment and inject a molding material into a molding cavity provided therebetween, thereby producing an optical part. The metal mold assembly is one including fixed platen (11) supporting fixed mold (27), provided on part of its mold-side surface with locating hole (11a) and including ring (12) of configuration with external and internal surfaces, fitted at its external surface in the locating hole (11a), wherein the fixed mold (27) is provided with locating projection (21a) protruding toward the fixed platen (11), fitted in the internal surface of the locating hole (11a), and wherein the ring (12) consists of a material whose linear expansion coefficient is smaller than those of the material of the fixed platen (11) and the material of the locating projection (21a).

SEKIHARA, Kanji (Inc. 2970 Ishikawa-machi, Hachioji-sh, Tokyo 05, 1928505, JP)
関原 幹司 (〒05 東京都八王子市石川町２９７０番地コニカミノルタオプト株式会社内 Tokyo, 1928505, JP)
OKUMURA, Yoshihiro (Inc. 2970 Ishikawa-machi, Hachioji-sh, Tokyo 05, 1928505, JP)

JP2007/066544

March 13, 2008

August 27, 2007

Click for automatic bibliography generation  

Konica Minolta Opto, Inc. (2970, Ishikawa-machi Hachioji-sh, Tokyo 05, 1928505, JP)
コニカミノルタオプト株式会社 (〒05 東京都八王子市石川町２９７０番地 Tokyo, 1928505, JP)
SEKIHARA, Kanji (Inc. 2970 Ishikawa-machi, Hachioji-sh, Tokyo 05, 1928505, JP)
関原 幹司 (〒05 東京都八王子市石川町２９７０番地コニカミノルタオプト株式会社内 Tokyo, 1928505, JP)

B29C33/30; B29C45/26; B29L11/00; B29C33/30; B29C45/26

View/Download PDF      PDF Help

Previous Patent: ORGANIC ELECTROLUMINESCENT DEVICE, ILLUMINATING DEVICE AND DISPLAY

Next Patent: SEMICONDUCTOR SENSOR DEVICE AND METHOD FOR MANUFACTURING SAME