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Title:
METAL MULTILAYER MATERIAL FORMED FROM COPPER AND MAGNESIUM AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2017/209157
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a metal multilayer material using a magnesium alloy, which achieves a good balance between high heat dissipation performance and lightweightness, while additionally having electrical conductivity. A metal multilayer material 1 which has a two-layer structure composed of a copper layer 10 and a magnesium alloy layer 20, and which does not have an intermetallic compound at the interface.

Inventors:
KUROKAWA Teppei (Toyo Kohan Co. Ltd., 1296-1, Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
HASHIMOTO Yusuke (Toyo Kohan Co. Ltd., 1296-1, Higashitoyoi, Kudamatsu-sh, Yamaguchi 11, 〒7448611, JP)
Application Number:
JP2017/020174
Publication Date:
December 07, 2017
Filing Date:
May 31, 2017
Export Citation:
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Assignee:
TOYO KOHAN CO., LTD. (2-12, Yonban-cho Chiyoda-k, Tokyo 47, 〒1028447, JP)
International Classes:
B32B15/01; C23F4/00; C22F1/00; C22F1/06; C22F1/08
Attorney, Agent or Firm:
HIRAKI & ASSOCIATES (Atago Green Hills MORI Tower 32F, 5-1 Atago 2-chome, Minato-k, Tokyo 32, 〒1056232, JP)
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