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Patent Searching and Data


Title:
METAL NANOPOWDER COMPRISING SOLID SOLUTION OF SILVER AND COPPER
Document Type and Number:
WIPO Patent Application WO/2020/045728
Kind Code:
A1
Abstract:
The present invention relates to a metal nanopowder comprising a solid solution of silver and copper and, more specifically, to a metal nanopowder, which: can have a remarkably reduced oxidation rate compared with that of a single metal even if exposed to air since the metal nanopowder is present in a metal nanopowder form formed from a solid solution of silver, which is crystalline and has a multiphase and uniform porosity, and copper, which is amorphous, thereby exhibiting excellent corrosion resistance; and exhibits excellent conductivity even in a powder form, thereby having a remarkably lower electric resistance compared with that of silver, which exhibits the lowest electric resistance from among metals.

Inventors:
YOON CHAN HEON (KR)
Application Number:
PCT/KR2018/011724
Publication Date:
March 05, 2020
Filing Date:
October 04, 2018
Export Citation:
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Assignee:
YOUNG DONG TECH CO LTD (KR)
International Classes:
B22F1/054; B22F1/08
Foreign References:
KR20140092801A2014-07-24
KR20140003752A2014-01-10
JP2015021143A2015-02-02
KR20070104802A2007-10-29
KR20100046459A2010-05-07
KR101279640B12013-06-27
KR100428948B12004-04-29
Other References:
ELECTROCHEMISTRY COMMUNICATIONS, vol. 9, 2007, pages 2514 - 2518
METALS, vol. 4, no. 1, 2014, pages 65 - 83
CHANG CH ET AL., CARBON, vol. 50, 2012, pages 5044 - 51
See also references of EP 3845331A4
Attorney, Agent or Firm:
KIM, Jong Seok (KR)
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