Title:
METAL NANOWIRE PRODUCTION METHOD, METAL NANOWIRE, DISPERSION LIQUID, AND CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2023/140011
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a metal nanowire production method whereby it is possible to obtain a metal nanowire with low connection resistance; a metal nanowire; a dispersion liquid; and a conductive film. This metal nanowire production method includes an anodization step in which a porous anodized film is formed on the surface of a valve metal substrate, a metal filling step in which the pores are filled with a metal, a mold removal step in which the anodized film and the valve metal substrate are removed and needle-shaped metal is obtained, and a protective layer formation step in which a protective layer containing a corrosion inhibitor is formed on the needle-shaped metal.
Inventors:
KUROOKA SHUNJI (JP)
SHIMADA KAZUTO (JP)
KASUYA YUICHI (JP)
SHIMADA KAZUTO (JP)
KASUYA YUICHI (JP)
Application Number:
PCT/JP2022/046873
Publication Date:
July 27, 2023
Filing Date:
December 20, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C25D1/00; B22F1/00; B22F1/0545; B22F9/00; C25D11/20; C25D11/24; H01B1/00; H01B1/02; H01B1/22; H01B5/00; H01B5/14; H01B5/16; H01B13/00
Domestic Patent References:
| WO2018155273A1 | 2018-08-30 |
Foreign References:
| JP2012238592A | 2012-12-06 | |||
| JP2009505358A | 2009-02-05 | |||
| JP2016053212A | 2016-04-14 | |||
| JP2016507400A | 2016-03-10 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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