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Patent Searching and Data


Title:
METAL PACKAGING MATERIAL HAVING GOOD HEAT RESISTANCE, METHOD OF MANUFACTURING SAME, AND FLEXIBLE ELECTRONIC DEVICE PACKAGED IN SAID METAL PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2015/093903
Kind Code:
A1
Abstract:
The present invention relates to a metal packaging material having good heat resistance, a method of manufacturing same, and a flexible electronic device packaged in said metal packaging material, and particularly, to a metal packaging material having excellent flexibility, moisture resistance, workability, and heat resistance by forming a coating layer including a metal-graphite composite on one surface thereof, to a method of manufacturing same, and a flexible electronic device packaged in said metal packaging material.

Inventors:
PARK YOUNG-JUN (KR)
KIM KYOUNG-BO (KR)
KIM MOO-JIN (KR)
LEE SOO-CHERL (KR)
LEE JAE-RYUNG (KR)
Application Number:
PCT/KR2014/012606
Publication Date:
June 25, 2015
Filing Date:
December 19, 2014
Export Citation:
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Assignee:
POSCO (KR)
International Classes:
B32B15/08; H01L51/56
Foreign References:
KR20120089935A2012-08-16
KR101332362B12013-12-02
KR20120006844A2012-01-19
KR20130105021A2013-09-25
Attorney, Agent or Firm:
C&S PATENT AND LAW OFFICE (KR)
특허법인 씨엔에스 (KR)
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