Title:
METAL PARTICLE POWDER AND PASTE COMPOSITION USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/099161
Kind Code:
A1
Abstract:
In the present invention, it is important that the metal particles used in a conductive paste used for wiring have the characteristic of being easily dispersed in a polar solvent in combination with other materials used in a paste that is resin or the like. Provided is a metal particle powder whereby the pH value exhibited is no greater than 6 when 0.5 g of the metal particles to be evaluated are added to 100 mL of a potassium hydroxide solution having a pH of 11 and then 0.10 mol/L nitric acid is added at the quantity of aqueous solution of nitric acid resulting in a pH of 5 when the 0.10 mol/L nitric acid is added to 100 mL of potassium hydroxide solution having a pH of 11 and 10 mL of ethyl alcohol (blank solution).
Inventors:
UEYAMA TOSHIHIKO (JP)
SASAKI SHINYA (JP)
SASAKI SHINYA (JP)
Application Number:
PCT/JP2012/050956
Publication Date:
July 26, 2012
Filing Date:
January 18, 2012
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
UEYAMA TOSHIHIKO (JP)
SASAKI SHINYA (JP)
UEYAMA TOSHIHIKO (JP)
SASAKI SHINYA (JP)
International Classes:
B22F1/00; B22F1/054; B22F1/0545; B22F1/102
Foreign References:
| JP2009084614A | 2009-04-23 | |||
| JP2007204837A | 2007-08-16 | |||
| JP2005179096A | 2005-07-07 | |||
| JP2004327669A | 2004-11-18 | |||
| JP4344001B2 | 2009-10-14 | |||
| JP2010073705A | 2010-04-02 | |||
| JP2009084614A | 2009-04-23 | |||
| JP2007204817A | 2007-08-16 | |||
| JP2005179096A | 2005-07-07 | |||
| JP2004327669A | 2004-11-18 |
Attorney, Agent or Firm:
HIROKOH, MASAKI (JP)
Hiroyuki Masaki (JP)
Hiroyuki Masaki (JP)
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Claims:
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