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Title:
METAL PASTE, BONDING METHOD AND METHOD FOR PRODUCING BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2020/196299
Kind Code:
A1
Abstract:
A metal paste which is used for bonding at a low temperature of 600°C or less, and which contains metal particles having an average particle diameter of 1-100 μm, metal nanoparticles having an average particle diameter of 1-500 nm, a stress relaxation material, and a dispersion where the metal particles, the metal nanoparticles and the stress relaxation material are dispersed.

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Inventors:
NAKAJO HARUYUKI (JP)
YOSHIMOTO MIZUKI (JP)
Application Number:
PCT/JP2020/012389
Publication Date:
October 01, 2020
Filing Date:
March 19, 2020
Export Citation:
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Assignee:
HARIMA CHEMICALS INC (JP)
International Classes:
B22F1/00; B22F1/16; B22F7/08
Domestic Patent References:
WO2019054225A12019-03-21
Foreign References:
JP2006196245A2006-07-27
JP2017074598A2017-04-20
JP2017074598A2017-04-20
JP2014167145A2014-09-11
JP2012009703A2012-01-12
Other References:
See also references of EP 3943215A4
Attorney, Agent or Firm:
PATENTBOX IP LAW FIRM (JP)
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