Title:
METAL PASTE FOR JOINING, JOINT, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/282235
Kind Code:
A1
Abstract:
This metal paste for joining includes metal particles, a dispersion medium, a reducing agent, and a reduction assistance agent, wherein: the metal particles contain copper particles; the reduction assistance agent includes a coordinating compound having electron reverse donation properties; the coordinating compound is at least one compound selected from the group consisting of organic phosphorous compounds and organic sulfur compounds; and a polyol-based compound is included as the reducing agent in an amount of 1.6–10 parts by mass relative to 100 parts by mass of the total mass of the copper particles.
Inventors:
NAKAKO HIDEO (JP)
EJIRI YOSHINORI (JP)
TANAKA TOSHIAKI (JP)
ISHIKAWA DAI (JP)
NATORI MICHIKO (JP)
EJIRI YOSHINORI (JP)
TANAKA TOSHIAKI (JP)
ISHIKAWA DAI (JP)
NATORI MICHIKO (JP)
Application Number:
PCT/JP2022/026625
Publication Date:
January 12, 2023
Filing Date:
July 04, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B22F9/00; B22F1/00; B22F7/08; C09J9/02; H01B1/22; H01L21/52
Domestic Patent References:
| WO2020032161A1 | 2020-02-13 |
Foreign References:
| JP2013115004A | 2013-06-10 | |||
| JP2020020015A | 2020-02-06 | |||
| JP2021048396A | 2021-03-25 | |||
| JP2011252194A | 2011-12-15 | |||
| JP4247800B2 | 2009-04-02 | |||
| JP5006081B2 | 2012-08-22 |
Other References:
R. KHAZAKAL. MENDIZABALD. HENRY, J., vol. 43, no. 7, 2014, pages 2459 - 2466
T. MORITAY YASUDA, MATERIALS TRANSACTIONS, vol. 56, no. 6, 2015, pages 878 - 882
KATSUHIRO UEDASUMIO INAFUKUIWAO MORI, CHEMISTRY AND EDUCATION, vol. 40, no. 2, 1992, pages 114 - 117
T. MORITAY YASUDA, MATERIALS TRANSACTIONS, vol. 56, no. 6, 2015, pages 878 - 882
KATSUHIRO UEDASUMIO INAFUKUIWAO MORI, CHEMISTRY AND EDUCATION, vol. 40, no. 2, 1992, pages 114 - 117
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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