Title:
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/168186
Kind Code:
A1
Abstract:
Provided is a metal paste for joints which contains metal particles and a linear or branched C1–20 monovalent aliphatic alcohol, and in which the metal particles include submicrometer copper particles having a volume mean diameter of 0.12–0.8 μm.
Inventors:
KAWANA YUKI (JP)
NAKAKO HIDEO (JP)
NEGISHI MOTOHIRO (JP)
ISHIKAWA DAI (JP)
SUGAMA CHIE (JP)
EJIRI YOSHINORI (JP)
NAKAKO HIDEO (JP)
NEGISHI MOTOHIRO (JP)
ISHIKAWA DAI (JP)
SUGAMA CHIE (JP)
EJIRI YOSHINORI (JP)
Application Number:
PCT/JP2018/001409
Publication Date:
September 20, 2018
Filing Date:
January 18, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B22F1/052; B22F1/068; B22F1/10; B22F1/107; B22F9/00; H01L21/52
Domestic Patent References:
| WO2016031619A1 | 2016-03-03 |
Foreign References:
| JP2014167145A | 2014-09-11 | |||
| JP2015227476A | 2015-12-17 | |||
| JPS4928639B1 | 1974-07-27 | |||
| JPS506081B1 | 1975-03-11 | |||
| JP2014167145A | 2014-09-11 | |||
| JP6060199B2 | 2017-01-11 | |||
| JP3736797B2 | 2006-01-18 |
Other References:
R. KHAZAKAL. MENDIZABALD. HENRY, J. ELECTRON. MATER, vol. 43, no. 7, 2014, pages 2459 - 2466
See also references of EP 3597331A4
See also references of EP 3597331A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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