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Patent Searching and Data


Title:
METAL PASTE AND THERMOELECTRIC MODULE
Document Type and Number:
WIPO Patent Application WO/2017/105011
Kind Code:
A8
Abstract:
The present invention relates to a metal paste and a thermoelectric module having, applied thereto, a bonding technique using the metal paste, the metal paste comprising: a first metal powder comprising nickel (Ni); a second metal powder comprising at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent.

Inventors:
LEE DAE KI (KR)
KIM DONG-SIK (KR)
PARK CHEOL-HEE (KR)
Application Number:
PCT/KR2016/014056
Publication Date:
July 27, 2017
Filing Date:
December 01, 2016
Export Citation:
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Assignee:
LG CHEMICAL LTD (KR)
International Classes:
H01L35/12; H01B1/22; H01L35/14; H01L35/18; H01L35/24; H01L35/30; H01L35/32; H01L35/34
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (KR)
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