Title:
METAL PLATE, LAMINATE, AND INSULATED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/202795
Kind Code:
A1
Abstract:
This metal plate (30) comprises a plate body (31), and a roughened plating layer (35) formed on the outermost layer of the plate body (31). A protuberance (36) projecting away from the plate body (31) is formed on the roughened plating layer (35). The area ratio of a region having a KAM value of 1.0 or greater in a region extending 6 µm in the thickness direction from the outermost layer of the roughened plating layer (35) is 10% or less, and either the developed interfacial area ratio (Sdr) of the outermost surface of the roughened plating layer (35) is 20% or greater, or the R (developed interfacial linear length ratio) of the outermost surface of the roughened plating layer (35) is 40% or greater.
Inventors:
SAKAMAKI MARINA (JP)
KUBOTA KENJI (JP)
OHASHI TOYO (JP)
KUBOTA KENJI (JP)
OHASHI TOYO (JP)
Application Number:
PCT/JP2022/013103
Publication Date:
September 29, 2022
Filing Date:
March 22, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B32B15/08; H01L23/12; H01L23/14; H05K1/05
Foreign References:
| JP2001073171A | 2001-03-21 | |||
| JP2020163650A | 2020-10-08 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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