Title:
METAL-PLATED LAMINATED BOARD, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2013/088659
Kind Code:
A1
Abstract:
This metal-plated laminated board is provided with an insulating layer, and a metal layer, which is present at least on one surface side of the insulating layer. The insulating layer is configured by laminating at least three layers, i.e., a center layer, a first resin layer that is present at least on one surface side of the center layer, and a second resin layer that is present on the other surface side of the center layer. The center layer contains a hardened material of a resin composition, and a fiber base material, and the first resin layer and the second resin layer are respectively composed of hardened materials of resin compositions. The resin composition of the center layer contains a thermosetting resin, the resin contained in the resin composition of the center layer is different from resins contained in the resin compositions of the first resin layer and the second resin layer, and thermal expansion coefficients of the hardened materials of the resin compositions contained in the first resin layer and the second resin layer are smaller than the thermal expansion coefficient of the hardened material of the resin composition contained in the center layer.
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Inventors:
INOUE HIROHARU
KISHINO KOJI
KISHINO KOJI
Application Number:
PCT/JP2012/007664
Publication Date:
June 20, 2013
Filing Date:
November 29, 2012
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
B32B15/08; B32B7/027; H05K1/03
Foreign References:
| JP2011235583A | 2011-11-24 | |||
| JP2007123712A | 2007-05-17 | |||
| JP2009173017A | 2009-08-06 | |||
| JPH01244841A | 1989-09-29 | |||
| JPH05147152A | 1993-06-15 | |||
| JPH04162487A | 1992-06-05 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
Etsuji Kotani (JP)
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Claims: