Title:
METAL POLISHING
Document Type and Number:
WIPO Patent Application WO2003018252
Kind Code:
A3
Abstract:
The present invention provides a process and liquid composition for selectively removing a metal film from a patterned substrate. The process, which is useful in the manufacture of semiconductor devices and circuits, comprises chemically reacting the metal film with a liquid and then removing the reaction product from the metal surfaces using a polishing pad. The present invention further provides a process to polish a metal surface in separate stages and at different rates by changing the chemical composition of the liquid.
Inventors:
PILLION JOHN E (US)
SHYU JIEH HWA (US)
BELONGIA BRETT (US)
SHYU JIEH HWA (US)
BELONGIA BRETT (US)
Application Number:
PCT/US2002/024851
Publication Date:
November 13, 2003
Filing Date:
August 06, 2002
Export Citation:
Assignee:
MYKROLIS CORP (US)
PILLION JOHN E (US)
SHYU JIEH HWA (US)
BELONGIA BRETT (US)
PILLION JOHN E (US)
SHYU JIEH HWA (US)
BELONGIA BRETT (US)
International Classes:
B24B37/20; B24B37/22; B24B37/24; B24D11/00; C23F3/00; H01L21/321; H01L21/3213; (IPC1-7): B24B7/22
Foreign References:
| US6117775A | 2000-09-12 | |||
| US6228771B1 | 2001-05-08 | |||
| US6238592B1 | 2001-05-29 | |||
| US6217416B1 | 2001-04-17 |
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