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Title:
METAL PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/016899
Kind Code:
A1
Abstract:
The present invention relates to a metal printed circuit board and a method for producing same. The metal printed circuit board according to the present invention comprises: a metal base plate having at least one heat-transferring protrusion protruding from a surface thereof; an insulation sheet having a thru-hole into which the heat-transferring protrusion is inserted, and superposed on the surface of the metal base plate such that the heat-transferring protrusion is inserted into the thru-hole; a metal sheet having a thru-hole into which the heat-transferring protrusion is inserted, and superposed on the upper surface of the insulation sheet such that the heat-transferring protrusion is inserted into the thru-hole; and a circuit layer formed by being plated on the upper surfaces of the metal sheet and the heat-transferring protrusion. The circuit layer is configured to include: a heat-transferring protrusion pattern formed by etching the parts of the circuit layer and the metal sheet around the heat-transferring protrusion such that the heat-transferring protrusion is electrically separated from the circuit layer; and a circuit pattern formed on the periphery of the heat-transferring protrusion pattern by etching.

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Inventors:
CHA SEUNG JIN (KR)
Application Number:
PCT/KR2017/007843
Publication Date:
January 25, 2018
Filing Date:
July 20, 2017
Export Citation:
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Assignee:
CHA SEUNG JIN (KR)
International Classes:
H05K3/42; H05K1/02; H05K3/06; H05K3/24; H05K3/26; H05K3/28
Domestic Patent References:
WO2011140141A22011-11-10
Foreign References:
JP2014103354A2014-06-05
KR20050043549A2005-05-11
KR100442918B12004-08-02
KR20010050954A2001-06-25
Attorney, Agent or Firm:
DYNE PATENT & LAW FIRM (KR)
Download PDF:
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