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Patent Searching and Data


Title:
METAL PRODUCT PRODUCING METHOD, METAL PRODUCT, METAL COMPONENT CONNECTING METHOD, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2004/111303
Kind Code:
A1
Abstract:
A product body is formed, and a defect peripheral portion including a defect produced in the treated surface of the product body by the forming is removed to form a recess in the treated surface. By using a molded body molded from a metal powder or a molded electrode fabricated from the heat-treated molded body, pulse discharge is caused between the recess peripheral portion including the recess and the molded electrode in an electrically insulating liquid or in the air. On the material of the molded electrode, deposition is formed by using the discharge energy to gradually form a build-up around the recess.

Inventors:
OCHIAI HIROYUKI (JP)
WATANABE MITSUTOSHI (JP)
URABE TATSUTO (JP)
GOTO AKIHIRO (JP)
AKIYOSHI MASAO (JP)
Application Number:
PCT/JP2004/008212
Publication Date:
December 23, 2004
Filing Date:
June 11, 2004
Export Citation:
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Assignee:
ISHIKAWAJIMA HARIMA HEAVY IND (JP)
MITSUBISHI ELECTRIC CORP (JP)
OCHIAI HIROYUKI (JP)
WATANABE MITSUTOSHI (JP)
URABE TATSUTO (JP)
GOTO AKIHIRO (JP)
AKIYOSHI MASAO (JP)
International Classes:
B23H1/00; B23H1/06; B23H9/00; C23C26/00; (IPC1-7): C23C26/00; B22D29/00; B23H5/00; C21D9/50
Foreign References:
JPH09192937A1997-07-29
JPH04309452A1992-11-02
JPS62161493A1987-07-17
JPS6117398A1986-01-25
Other References:
See also references of EP 1659196A4
Attorney, Agent or Firm:
Miyoshi, Hidekazu (Toranomon 1-chome Minato-ku, Tokyo, JP)
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