Title:
METAL SEAL PACKAGING FOR ORGANIC LIGHT EMITTING DIODE DEVICE
Document Type and Number:
WIPO Patent Application WO2004092566
Kind Code:
A3
Abstract:
A metal sealed organic light emitting diode device (Fig. 7) comprising a lid (79), containing a recessed portion (83) to accommodate large quantity of getter/dessicant (57, 82, 93), a band (45) of metal stack at the perimeter over which is laid a band of low temperature melting solder alloy, pre-tinned subsequently, and a substrate (71) containing organic light emitting diode (46) at the central area with a band (45) of metal stack at the perimeter. The lid (79) and the substrate (71) are placed together in substantial alignment such that the pre-tinned low melting solder band of the lid contacts the metal stack of the substrate and thermally sealed in a controlled atmosphere. Multiples of substrates are sealed with a single lid containing multiplicity of recessed portions (91) with multi-segmented metal stack and pre-tinned solder band (92) to derive a large area device.
Inventors:
ANANDAN MUNISAMY (US)
Application Number:
PCT/US2004/010664
Publication Date:
September 22, 2005
Filing Date:
April 07, 2004
Export Citation:
Assignee:
ANANDAN MUNISAMY (US)
International Classes:
H01J1/62; H01L21/56; H01L51/52; F02F; (IPC1-7): H01J1/62; H01L21/56
Foreign References:
| US6657382B2 | 2003-12-02 | |||
| US6628071B1 | 2003-09-30 |
Download PDF:
Previous Patent: START CONTROLLER AND START CONTROL METHOD OF ENGINE
Next Patent: INTEGRATED BYPASS TURBOJET ENGINES FOR AIRCRAFT AND OTHER VEHICLES
Next Patent: INTEGRATED BYPASS TURBOJET ENGINES FOR AIRCRAFT AND OTHER VEHICLES