Title:
METAL SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2015/151773
Kind Code:
A1
Abstract:
Provided is a metal substrate wherein, by laminating a predetermined film on a metal plate, the surface of the film is smoothed, and the film exhibits insulating properties. This metal substrate to be used in sub-straight-type thin film solar cells or top-emission-type organic EL elements is characterized in that: one layer of a thermoplastic resin film is laminated on the surface of a metal plate with an adhesive therebetween; the film is obtained from a composition wherein a volume fraction of a solid pigment is equal to or less than 20 %; the film thickness is 12-250 μm; and the surface roughness (Ra) of the film surface after the lamination is equal to or less than 30 nm.
Inventors:
HIRANO YASUO
IWA TATSUHIKO
WATASE TAKESHI
MIZUNO MASAO
SHIDA YOKO
IWA TATSUHIKO
WATASE TAKESHI
MIZUNO MASAO
SHIDA YOKO
Application Number:
PCT/JP2015/057684
Publication Date:
October 08, 2015
Filing Date:
March 16, 2015
Export Citation:
Assignee:
KOBE STEEL LTD (JP)
International Classes:
H01L31/0392; B32B15/08; H01L51/50; H05B33/02
Foreign References:
| JP2011108883A | 2011-06-02 | |||
| JP2003282258A | 2003-10-03 | |||
| JP2002025763A | 2002-01-25 | |||
| JP2013084461A | 2013-05-09 | |||
| JP2011222779A | 2011-11-04 | |||
| JP2014208479A | 2014-11-06 |
Attorney, Agent or Firm:
UEKI, Kyuichi et al. (JP)
Hisakazu Ueki (JP)
Hisakazu Ueki (JP)
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