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Title:
METAL SUPPORTING BODY FOR ELECTROCHEMICAL ELEMENT, ELECTROCHEMICAL ELEMENT, ELECTROCHEMICAL MODULE, ELECTROCHEMICAL DEVICE, ENERGY SYSTEM, SOLID OXIDE FUEL CELL, AND PRODUCTION METHOD FOR METAL SUPPORTING BODY
Document Type and Number:
WIPO Patent Application WO/2019/189911
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a metal support-type electrochemical element, etc., having a minimized degree of warpage. This metal supporting body for an electrochemical element has a plate-shaped surface and has a plate shape overall. A least squares value is calculated using the least squares method, using at least three points P inside the plate-shaped surface of the metal supporting body 1. A first difference and a second difference are calculated, said first difference being between the least squares value and a plus-side maximum displacement value towards the plus side relative to the least squares value and said second difference being between the least squares value and a minus-side maximum displacement value towards the minus side, opposite to the plus side, relative to the least squares value. Da divided by Lmax is the degree of warpage Da/Lmax, Da being the sum of the first difference and the second difference and Lmax being the maximum length of the plate-shaped surface of the metal supporting body through the center of gravity. The degree of warpage is no more than 1.5 × 10–2.

Inventors:
TSUDA Yuji (1-2, Hiranomachi 4-chome, Chuo-ku, Osaka-sh, Osaka 46, 〒5410046, JP)
ECHIGO Mitsuaki (1-2, Hiranomachi 4-chome, Chuo-ku, Osaka-sh, Osaka 46, 〒5410046, JP)
SOGI Tadayuki (1-2, Hiranomachi 4-chome, Chuo-ku, Osaka-sh, Osaka 46, 〒5410046, JP)
MINAMI Kazuyuki (1-2, Hiranomachi 4-chome, Chuo-ku, Osaka-sh, Osaka 46, 〒5410046, JP)
MANABE Kyohei (1-2, Hiranomachi 4-chome, Chuo-ku, Osaka-sh, Osaka 46, 〒5410046, JP)
Application Number:
JP2019/014376
Publication Date:
October 03, 2019
Filing Date:
March 29, 2019
Export Citation:
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Assignee:
OSAKA GAS CO., LTD. (1-2 Hiranomachi 4-chome, Chuo-ku Osaka-sh, Osaka 46, 〒5410046, JP)
International Classes:
H01M8/1226; H01M8/00; H01M8/12; H01M8/1213; H01M8/124; H01M8/1286
Foreign References:
JP2016066616A2016-04-28
JP2013201038A2013-10-03
JP2013077448A2013-04-25
JP2013041717A2013-02-28
JP2010129459A2010-06-10
JP2010080428A2010-04-08
JP2005150053A2005-06-09
Attorney, Agent or Firm:
R&C IP LAW FIRM (3-3 Nakanoshima 3-chome, Kita-ku Osaka-sh, Osaka 05, 〒5300005, JP)
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