Title:
METAL SURFACE PROTECTION FILM FORMING AGENT AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2003/012169
Kind Code:
A1
Abstract:
A metal surface protection film forming agent containing a specific &agr −amino acid such as leucine and phenyl alanine, and a metal abrasive liquid using this. The agent can be used as an abrasive liquid used in a chemical−mechanical polishing method in semiconductor circuit fabrication, is composed of various safe additives light in environmental load, and can restrict the dishing of metal wiring especially copper metal wiring and corrosion during polishing. Such a specific &agr −amino acid used adsorbs to a wiring metal surface, especially a copper metal surface buried in a substrate recess or reacts with the metal to prevent the elution of the metal and forms a protection film on the metal surface. A metal surface protection film forming agent and a method of polishing a substrate surface for producing a semiconductor−use substrate, a method of forming a metal surface protection film, the application of the specific amino acid to a metal surface protection film forming agent, and a semiconductor circuit−use substrate using them, a semiconductor circuit containing it and methods of producing them.
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Inventors:
FURUTA KIYONORI (JP)
KURAUCHI MASAHIKO (JP)
SATO HIROYUKI (JP)
KURAUCHI MASAHIKO (JP)
SATO HIROYUKI (JP)
Application Number:
PCT/JP2002/004180
Publication Date:
February 13, 2003
Filing Date:
April 26, 2002
Export Citation:
Assignee:
AJINOMOTO KK (JP)
FURUTA KIYONORI (JP)
KURAUCHI MASAHIKO (JP)
SATO HIROYUKI (JP)
FURUTA KIYONORI (JP)
KURAUCHI MASAHIKO (JP)
SATO HIROYUKI (JP)
International Classes:
C09K13/06; C09G1/02; C09G1/04; C23C22/68; C23F3/00; C23F3/04; C23F11/10; C23F11/14; H01L21/304; H01L21/3205; H01L21/321; (IPC1-7): C23F11/00
Foreign References:
| JPS5051938A | 1975-05-09 |
Other References:
See also references of EP 1413650A4
Attorney, Agent or Firm:
Ishida, Yasumasa (Bohsei Bldg. 7th Floor, 20-12, Shin-Yokohama
3-chome, Kohoku-k, Yokohama-shi Kanagawa, JP)
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