Title:
METAL THIN FILM PRODUCTION METHOD AND METAL THIN FILM
Document Type and Number:
WIPO Patent Application WO/2010/095672
Kind Code:
A1
Abstract:
Provided is a metal thin film formation method where using a metal particle dispersion, a conducting layer with a low volume resistivity is obtained on an insulated substrate. Said method includes a production step where a coating film including a metal particle dispersion is heat treated using superheated steam. Also provided is a metal thin film produced via said method. It is desirable that the coating film be formed from the metal particle dispersion being spread or printed onto the insulated substrate. The metal particle dispersion may contain a reducing agent, and the superheated steam may contain alcohol compounds.
Inventors:
YATSUKA TAKESHI (JP)
AYUZAWA YOSHITAKA (JP)
KIZUMOTO HIROTOSHI (JP)
SHOKI KOJI (JP)
AYUZAWA YOSHITAKA (JP)
KIZUMOTO HIROTOSHI (JP)
SHOKI KOJI (JP)
Application Number:
PCT/JP2010/052405
Publication Date:
August 26, 2010
Filing Date:
February 18, 2010
Export Citation:
Assignee:
TOYO BOSEKI (JP)
YATSUKA TAKESHI (JP)
AYUZAWA YOSHITAKA (JP)
KIZUMOTO HIROTOSHI (JP)
SHOKI KOJI (JP)
YATSUKA TAKESHI (JP)
AYUZAWA YOSHITAKA (JP)
KIZUMOTO HIROTOSHI (JP)
SHOKI KOJI (JP)
International Classes:
H01B13/00; B22F1/00; H01B5/14; H05K3/12
Domestic Patent References:
| WO2008001600A1 | 2008-01-03 |
Foreign References:
| JP2004288448A | 2004-10-14 | |||
| JP2000348549A | 2000-12-15 | |||
| JPH05166414A | 1993-07-02 |
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