Title:
METAL WIRE HAVING ABRASIVE GRAINS BONDED THERETO AND METHOD FOR MANUFACTURING METAL WIRE HAVING ABRASIVE GRAINS BONDED THERETO
Document Type and Number:
WIPO Patent Application WO/2012/124717
Kind Code:
A1
Abstract:
Provided is a high-speed method for manufacturing a metal wire having abrasive grains bonded thereto. A metal core is immersed in an electrodeposition liquid containing abrasive grains and colloid particles of a metal oxide; and a voltage of a polarity different from that of the colloid particles is applied to the metal core, so that the abrasive grains are caused to adhere, along with the colloid particles, to the metal core.
Inventors:
MATSUOKA AKIFUMI (JP)
YAMASHITA KENICHI (JP)
MORI KAZUHIKO (JP)
SHIMIZU HIROSHI (JP)
AIKAWA KOICHI (JP)
YOROZU TAKAYUKI (JP)
YAMASHITA KENICHI (JP)
MORI KAZUHIKO (JP)
SHIMIZU HIROSHI (JP)
AIKAWA KOICHI (JP)
YOROZU TAKAYUKI (JP)
Application Number:
PCT/JP2012/056495
Publication Date:
September 20, 2012
Filing Date:
March 14, 2012
Export Citation:
Assignee:
SUMITOMO ELECTRIC TOCHIGI CO LTD (JP)
NIHON PARKERIZING (JP)
MATSUOKA AKIFUMI (JP)
YAMASHITA KENICHI (JP)
MORI KAZUHIKO (JP)
SHIMIZU HIROSHI (JP)
AIKAWA KOICHI (JP)
YOROZU TAKAYUKI (JP)
NIHON PARKERIZING (JP)
MATSUOKA AKIFUMI (JP)
YAMASHITA KENICHI (JP)
MORI KAZUHIKO (JP)
SHIMIZU HIROSHI (JP)
AIKAWA KOICHI (JP)
YOROZU TAKAYUKI (JP)
International Classes:
B24D11/00; B24D3/00
Foreign References:
| JP2011016208A | 2011-01-27 | |||
| JP2010201542A | 2010-09-16 | |||
| JP2003181765A | 2003-07-02 | |||
| JP2003525130A | 2003-08-26 | |||
| JP2000254866A | 2000-09-19 |
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
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Claims:
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Next Patent: ELECTRODEPOSITION LIQUID FOR FIXED-ABRASIVE SAW WIRE