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Title:
METAL WIRE ROD PLATING INSOLUBLE ANODE AND METAL WIRE ROD PLATING METHOD USING IT
Document Type and Number:
WIPO Patent Application WO/2008/001892
Kind Code:
A1
Abstract:
A metal wire rod plating insoluble anode which can electroplate a plurality of metal wire rods concurrently and can make uniform a plating deposition amounts in these metal wire rods constantly and for an extended period. For this purpose, a plurality of insoluble electrode plates (20) are arranged in parallel and oppositely so as to hold a plurality of wire rod pass lines from the opposite sides. The plurality of insoluble electrode plates (20) are fastened and fixed by through bolts (40) at a plurality of locations in a pass line direction. Conductive spaces (30) are sandwiched between the insoluble electrode plates (20) at portions where they are fastened by the through bolts (40), and a conductive member (50) is provided so as to contact all the insoluble electrode plates (20) and the conductive spaces (30).

Inventors:
KAWAGUCHI KENJI (JP)
OTOGAWA RYUICHI (JP)
MURAKAMI KENICHI (JP)
NAKAMURA YUJI (JP)
Application Number:
PCT/JP2007/063129
Publication Date:
January 03, 2008
Filing Date:
June 29, 2007
Export Citation:
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Assignee:
DAISO CO LTD (JP)
BRIDGESTONE CORP (JP)
KAWAGUCHI KENJI (JP)
OTOGAWA RYUICHI (JP)
MURAKAMI KENICHI (JP)
NAKAMURA YUJI (JP)
International Classes:
C25D17/12; C25B9/17; C25D7/06
Foreign References:
JP2000192292A2000-07-11
JP2000192291A2000-07-11
Other References:
See also references of EP 2039809A4
Attorney, Agent or Firm:
YANAGIDATE, Takahiko (6-15 Kawaramachi,4-chome, Chuo-ku, Osaka-shi, Osaka 48, JP)
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