Title:
METALLIC FOIL COMPOSITE, FLEXIBLE PRINTED CIRCUIT BOARD USING SAME, MOLDED BODY, AND MANUFACTURING METHOD FOR MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2012/132814
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a metallic foil composite with an improved crease performance. The present invention relates to a metallic foil composite (10) formed of a metallic foil (2) layered on one or both surfaces of a resin layer (6) with an adhesive layer (4) interposed therebetween, wherein the combined elastic modulus of the layers, including the adhesive layer and the resin layer, is 80-100% of the elastic modulus of the resin layer.
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| JPS59225775 | PREPARATION OF RESIN COATED METAL |
Inventors:
KANMURI KAZUKI (JP)
Application Number:
PCT/JP2012/055933
Publication Date:
October 04, 2012
Filing Date:
March 08, 2012
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
KANMURI KAZUKI (JP)
KANMURI KAZUKI (JP)
International Classes:
B32B15/08; H05K1/03; B32B7/022
Domestic Patent References:
| WO2011004664A1 | 2011-01-13 | |||
| WO2011004664A1 | 2011-01-13 |
Foreign References:
| JP2006240073A | 2006-09-14 | |||
| JP2010194759A | 2010-09-09 | |||
| JPH07290449A | 1995-11-07 | |||
| JP3009383B2 | 2000-02-14 | |||
| JP2002217507A | 2002-08-02 | |||
| JP2005015861A | 2005-01-20 | |||
| JP2005004826A | 2005-01-06 | |||
| JPH0732307B2 | 1995-04-10 | |||
| JPH073237B2 | 1995-01-18 |
Other References:
See also references of EP 2679384A4
Attorney, Agent or Firm:
AKAO Kenichiro et al. (JP)
Ken-ichiro Akao (JP)
Ken-ichiro Akao (JP)
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Claims: