METALLIC MATERIAL FOR ELECTRONIC PART, ELECTRONIC PART, ELECTRONIC EQUIPMENT, METHOD OF WORKING METALLIC MATERIAL, PROCESS FOR PRODUCING ELECTRONIC PART AND ELECTRONIC OPTICAL PART

WIPO Patent Application WO/2004/022803

A1

An electronic part; an electronic equipment; a metal alloy material for use in such products; a method of working an electronic or metallic material; and an electronic optical part. For example, a metal alloy material for electronic parts that can be used in liquid crystal display devices, various semiconductor products and parts, printed wiring boards and other materials such as IC chip components, further exhibits a resistivity lower than those of conventional items, still further ensures advantage in the manufacturing process and is safe and excellent in workability; and an electronic part and electronic equipment from the metal alloy material. An alloy comprised mainly of Cu and containing 0.1 to 3.0 wt.% of Mo and a total of 0.1 to 3.0 wt.% of one or two or more elements selected from the group consisting of Al, Au, Ag, Ti, Ni, Co and Si is used as the metallic material. In this metallic material, Mo is added to Cu so as to effect homogeneous mixing of Mo in Cu grain boundary with the result that the weatherability of the whole body of Cu can be enhanced.

UENO TAKASHI (JP)

PCT/JP2003/011248

March 18, 2004

September 03, 2003

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DEPT CORP (JP)
UENO TAKASHI (JP)

G02F1/1343; C22C9/00; H01L21/28; H01L21/285; H01L23/498; H01L23/532; H05K1/09; (IPC1-7): C22C9/00; C22C9/01; C22C9/06; C22C9/10; C22F1/08; C23C14/34; H01L21/28; H01L21/3205; H01L21/3213

JPH06100984A	1994-04-12
JPH06256909A	1994-09-13
JP2003243325A	2003-08-29

See also references of EP 1559801A4

Yanase, Mutsuyasu (1-20-10-203 Takadanobab, Shinjuku-ku Tokyo, JP)

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