METALLIC POLISHING PAD AND PRODUCTION METHOD THEREFOR

Title:

METALLIC POLISHING PAD AND PRODUCTION METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2015/008572

Kind Code:

A1

Abstract:

Provided is a metallic polishing pad allowing the area coming in contact or in extreme close proximity with a catalyst to be increased on a surface to be processed. A metallic polishing pad (2) for smoothing a surface (6a) to be processed of a workpiece (6) by a catalyst-assisted chemical processing method is constituted from a compression-molded body of metal fibers comprising a transition metal catalyst. Being constituted from metal fibers, the compression-molded body has cavities therein, enabling elastic deformation of metal fibers present on a polishing pad surface (2a). Therefore, when the polishing pad surface (2a) and the surface (6a) to be processed of the workpiece (6) are pressed against each other, the metal fibers deform, adapting to the microscopic asperities present on the surface (6a), thereby reducing the space generated between the polishing pad surface (2a) and the surface (6a) to be processed. In this manner, the area coming in contact or in extreme close proximity with a catalyst can be increased on the surface (6a) to be processed.

Inventors:

ERYU OSAMU (JP)
YAMAGUCHI EIJI (JP)

Application Number:

PCT/JP2014/066169

Publication Date:

January 22, 2015

Filing Date:

June 18, 2014

Export Citation:

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Assignee:

NAGOYA INST TECHNOLOGY (JP)
SINTOKOGIO LTD (JP)

International Classes:

H01L21/304; B01J21/06; B01J23/755; B22F3/11; B22F3/14; B24B37/24

Foreign References:

JP2011129596A	2011-06-30
JP2013508197A	2013-03-07
JP2008254136A	2008-10-23
JP2010058170A	2010-03-18
JP2005236200A	2005-09-02
JPH07266215A	1995-10-17
JPH0271968A	1990-03-12
JPH09267270A	1997-10-14
JP4873694B2	2012-02-08
JP2008081389A	2008-04-10

Other References: