METALLIZED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME

Title:

METALLIZED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2020/009338

Kind Code:

A1

Abstract:

The present invention relates to a metallized ceramic substrate and a method for manufacturing same. The method for manufacturing a metallized ceramic substrate of the present invention, comprises the steps of: mixing copper powder and metal oxide to manufacture a copper paste; applying the copper paste to an upper surface of a ceramic substrate; and sintering the copper paste to form a copper metallization layer on the upper surface of the ceramic substrate. According to the present invention, it is possible to form, on the ceramic substrate, a thin copper metallization layer with high density, high bonding strength, and low impurities.

Inventors:

HAN MUN SOO (KR)
JUNG YOUNG SUNG (KR)

Application Number:

PCT/KR2019/006949

Publication Date:

January 09, 2020

Filing Date:

June 10, 2019

Export Citation:

Click for automatic bibliography generation Help

Assignee:

HAN MUN SOO (KR)

International Classes:

B05D7/24; B05D3/00; C04B41/51; C04B41/88; C09D1/00

Foreign References:

JP2737292B2	1998-04-08
JP2009253196A	2009-10-29
JP2004005558A	2004-01-08
KR20130075164A	2013-07-05
JP2008066628A	2008-03-21
KR20140026632A	2014-03-05
KR101766426B1	2017-08-08

Other References: