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Title:
METALLIZED PAPER BASED LIDDING MATERIAL FOR BLISTER PACKAGING & PROCESS THEREOF
Document Type and Number:
WIPO Patent Application WO/2009/118761
Kind Code:
A3
Abstract:
The present invention provides a high temperature and pressure resistant multilayered lidding material for blister packaging.

Inventors:
BHANDARI MOHAN HARAKCHAND (IN)
NAIK PRAFUL RAMCHANDRA (IN)
BHARADIA RAHUL GOPIKISAN (TH)
NAIR AJIT SASHIDHARAN (IN)
NAIK SUDHIR GAJANANRAO (IN)
KULKARNI SANJEEV DATTATRAYA (IN)
SANT ANIRUDHA CHANDRASEKHAR (IN)
PEDGAONKAR GANESH (IN)
Application Number:
PCT/IN2009/000196
Publication Date:
August 11, 2011
Filing Date:
March 24, 2009
Export Citation:
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Assignee:
BHANDARI MOHAN HARAKCHAND (IN)
NAIK PRAFUL RAMCHANDRA (IN)
BHARADIA RAHUL GOPIKISAN (TH)
NAIR AJIT SASHIDHARAN (IN)
NAIK SUDHIR GAJANANRAO (IN)
KULKARNI SANJEEV DATTATRAYA (IN)
SANT ANIRUDHA CHANDRASEKHAR (IN)
PEDGAONKAR GANESH (IN)
International Classes:
B32B13/00; A61J1/03; B65D75/36
Domestic Patent References:
WO2004093883A22004-11-04
Foreign References:
US4360550A1982-11-23
US4340141A1982-07-20
US6537680B12003-03-25
JP2006142597A2006-06-08
Attorney, Agent or Firm:
MOHAN, Dewan (Podar ChambersS.A. Brelvi Road, Fort,Mumbai 1, Maharashtra, IN)
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