Title:
METALLIZED RESIN FILM, PRINTED WIRING BOARD, CURRENT COLLECTOR FILM FOR LITHIUM-ION BATTERY, AND METHOD FOR PRODUCING METALLIZED RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2024/084906
Kind Code:
A1
Abstract:
This metallized resin film (10) comprises a resin composition layer (11), an electroless copper plating layer (12), and an adhesion layer (13) sandwiched between the resin composition layer (11) and the electroless copper plating layer (12). The resin composition layer (11) contains a polyimide resin for which the storage elastic modulus at a temperature of 300°C is 0.02 GPa or higher, and metal oxide particles. The adhesion layer (13) contains ionic copper and has an optical reflectivity of 30% or lower. The coefficient of linear expansion of the polyimide resin is preferably 30-100 ppm/K inclusive.
Inventors:
ITOH TAKASHI (JP)
Application Number:
PCT/JP2023/034921
Publication Date:
April 25, 2024
Filing Date:
September 26, 2023
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
B32B15/088; B32B7/027; B32B15/08; B32B15/20; C08K3/36; H01M4/13; H01M4/64; H01M4/66; H01M10/052; H05K1/03
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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