(METH)ACRYLATE-BASED RESIN, AND DRY FILM SOLDER RESIST COMPRISING SAME

Title:

(METH)ACRYLATE-BASED RESIN, AND DRY FILM SOLDER RESIST COMPRISING SAME

Document Type and Number:

WIPO Patent Application WO/2024/010189

Kind Code:

A1

Abstract:

The present invention relates to a (meth)acrylate-based resin, and a dry film solder resist comprising same and, specifically, to a (meth)acrylate-based resin in which generation of chlorine ions is reduced by regulating the types of a base resin and a reactant used in the manufacturing process, and to a dry film solder resist comprising same.

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Inventors:

MUN JEONG WOOK (KR)
JEONG WOO JAE (KR)
KIM SEUNG HWAN (KR)
KIM YU RA (KR)

Application Number:

PCT/KR2023/005278

Publication Date:

January 11, 2024

Filing Date:

April 19, 2023

Export Citation:

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Assignee:

LG CHEMICAL LTD (KR)

International Classes:

C08F290/06; C08F220/30; C08F220/32; H05K3/28

Foreign References:

KR20170104843A	2017-09-18
KR20110102641A	2011-09-19
KR101469257B1	2014-12-05
JP2016065122A	2016-04-28

Other References:

MCALVIN JOHN E, DOWD ZACHARY S, KINNIN LUCIANA F, MCCARTHY DAVID M, SIEGEL MICHAEL C, RODRIGUEZ DANIEL, SPIDLE RYAN T: "Next Generation Novolac Epoxy Vinyl Ester Resins for Heat Resistant Composites", TECHNICAL PAPER, 1 September 2016 (2016-09-01), pages 1 - 8, XP093126703

Attorney, Agent or Firm:

PCR INTELLECTUAL PROPERTY LAW FIRM (KR)

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