Title:
METHACRYLIC RESIN COMPOSITION AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2017/200032
Kind Code:
A1
Abstract:
A thermoplastic methacrylic resin composition which contains: 70-99.99% by mass of (A) a methacrylic resin such as a resin that contains a structural unit derived from methyl methacrylate and a structural unit having a ring structure in the main chain; and 0.01-30% by mass of (B) a compound that has three or more phenolic hydroxyl groups in each molecule, while having a molecular weight of 2,000-300,000 such as a polyvinyl phenol, a terpene phenolic resin and a novolac phenolic resin. A molded body which is formed from this resin composition.
Inventors:
ABE TORU (JP)
NAKAHARA ATSUHIRO (JP)
NAKAHARA ATSUHIRO (JP)
Application Number:
PCT/JP2017/018615
Publication Date:
November 23, 2017
Filing Date:
May 18, 2017
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
C08L33/12; C08J5/18; C08L21/00; C08L25/18; C08L45/00; C08L51/00; C08L53/00; C08L61/06; C08L69/00; G02B5/30
Domestic Patent References:
| WO2016185722A1 | 2016-11-24 |
Foreign References:
| JPH01146948A | 1989-06-08 | |||
| JP2011509434A | 2011-03-24 | |||
| JP2004529258A | 2004-09-24 | |||
| JPH03174465A | 1991-07-29 | |||
| JPH093168A | 1997-01-07 |
Attorney, Agent or Firm:
KIKUMA, Tadayuki (JP)
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