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Title:
METHACRYLIC RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2005/095478
Kind Code:
A1
Abstract:
A resin composition suitable for the formation of films which are excellent in transparency, weather resistance, hardness, impact resistance, resistance to fracture on bending, and moldability; and films which exhibit excellent weather resistance even when applied by lamination to moldings of plasticizer-containing PVC resin compositions. Films having the above characteristics can be made from a methacrylic resin composition (C) which is obtained by conducting the production of a methacrylate polymer (A) from a monomer mixture comprising an alkyl methacrylate as the main component by polymerization in the presence of crosslinked acrylic elastomer particles (B) obtained by copolymerizing a monomer mixture comprising an alkyl acrylate as the main component with a polyfunctional monomer having two or more nonconjugated double bonds per molecule and which is characterized by being copolymerized with 0.01 to 50 parts by weight of an ultraviolet absorber represented by the general formula (1).

Inventors:
WADA KAZUHITO (JP)
DOI NORITO (JP)
NISHIMURA KIMIHIDE (JP)
Application Number:
PCT/JP2005/005671
Publication Date:
October 13, 2005
Filing Date:
March 28, 2005
Export Citation:
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Assignee:
KANEKA CORP (JP)
WADA KAZUHITO (JP)
DOI NORITO (JP)
NISHIMURA KIMIHIDE (JP)
International Classes:
B32B27/30; C08F2/44; C08F220/36; C08F265/06; (IPC1-7): C08F220/36; C08F2/44; C08F265/06
Foreign References:
JPH09194542A1997-07-29
JPH0848802A1996-02-20
JPH07207106A1995-08-08
JP2004010805A2004-01-15
JP2003192742A2003-07-09
JPH08319326A1996-12-03
Other References:
See also references of EP 1731542A4
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-sh, Osaka 88, JP)
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