METHALLYL GROUP-CONTAINING RESIN, CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME

WIPO Patent Application WO/2018/199156

A1

Provided are: a methallyl group-containing resin which enables a curable resin composition to provide a cured product having excellently low moisture absorbency, excellent heat resistance and excellent dielectric characteristics, if used in the curable resin composition; a curable resin composition; and a cured product of the curable resin composition. A methallyl group-containing resin according to the present invention is represented by formula (1). (In the formula, Z represents a single bond, a hydrocarbon group, a carbon atom to which a heterocyclic ring is bonded, or the like; each Y represents a hydrogen atom or a methallyl group, and 20% or more of all Y moieties are methallyl groups; each R represents a hydrogen atom or the like; n represents an average that is a real number of 1-20; m represents an average that is a real number of 0-10, provided that in cases where m is 0, Z is not a single bond or a fluorene group; and the dotted line indicates the possible presence of a phenyl group.)

KUBOKI KENICHI (JP)
MATSUURA KAZUKI (JP)
NAKANISHI MASATAKA (JP)

PCT/JP2018/016783

November 01, 2018

April 25, 2018

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NIPPON KAYAKU KK (JP)

C08F12/34

JPH05186382A	1993-07-27
JPH05230368A	1993-09-07
JPH05239155A	1993-09-17
JPH07268068A	1995-10-17
JPH07268074A	1995-10-17
JPH07268078A	1995-10-17
JPH07330831A	1995-12-19
JPH09188666A	1997-07-22
JP2002356668A	2002-12-13
JP2014040358A	2014-03-06

SHIN-EI PATENT FIRM, P.C. (JP)

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