Title:
METHOD FOR ABRASION PROCESSING OF GLASS SUBSTRATE FOR SEMICONDUCTOR CHIP MOUNTING
Document Type and Number:
WIPO Patent Application WO/2012/014815
Kind Code:
A1
Abstract:
Disclosed is a method that is for abrasion processing of a glass substrate for semiconductor chip mounting, and that has: (a) a step for preparing the glass substrate; (b) a step for increasing the absorption of a first laser light having a wavelength in the ultraviolet region at the processing region of the aforementioned glass substrate; and (c) a step for radiating the aforementioned first laser light at the aforementioned processing region of the aforementioned glass substrate.
Inventors:
ONO Motoshi (Limited. 12-1, Yurakucho 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
小野 元司 (〒05 東京都千代田区有楽町一丁目１２番１号 旭硝子株式会社内 Tokyo, 〒1008405, JP)
小野 元司 (〒05 東京都千代田区有楽町一丁目１２番１号 旭硝子株式会社内 Tokyo, 〒1008405, JP)
Application Number:
JP2011/066732
Publication Date:
February 02, 2012
Filing Date:
July 22, 2011
Export Citation:
Assignee:
Asahi Glass Company, Limited. (5-1 Marunouchi 1-chome, Chiyoda-ku Tokyo, 05, 〒1008405, JP)
旭硝子株式会社 (〒05 東京都千代田区丸の内一丁目５番１号 Tokyo, 〒1008405, JP)
ONO Motoshi (Limited. 12-1, Yurakucho 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
旭硝子株式会社 (〒05 東京都千代田区丸の内一丁目５番１号 Tokyo, 〒1008405, JP)
ONO Motoshi (Limited. 12-1, Yurakucho 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
International Classes:
C03B33/08; B23K26/00; B23K26/36; C03C23/00; H01L23/12
Attorney, Agent or Firm:
OGURI Shohei et al. (Eikoh Patent Firm, Toranomon East Bldg. 10F 7-13, Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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Claims: