Title:
METHOD FOR ANALYZING RELATIONSHIP BETWEEN COMMUNICATION PATH AND HEAT RESISTANCE OF LIPASE
Document Type and Number:
WIPO Patent Application WO/2020/253221
Kind Code:
A1
Abstract:
A method for analyzing the relationship between a communication path and the heat resistance of a lipase, belonging to the technical field of computer applications. A Dijkstra's algorithm and an Apriori-like algorithm are combined so as to easily and quickly reveal the dynamic relationship between communication and thermostability for a lipase, and to discover information of a path between any two residues inside the structure, thereby solving the problem in the prior art in which important path segments inside the structure are not discovered and important path information is easily overlooked. Differences in communication strength between residues can also be expressed in a more accurate manner. The revealed relationship between communication and thermostability for the lipase is dynamic, thus overcoming the problem in which prior art techniques can only reflect static relationships between communication and thermostability for lipases, thereby providing an effective means for researching protein thermostability from an overall perspective.
Inventors:
DING YANRUI (CN)
XIA QIAN (CN)
XIA QIAN (CN)
Application Number:
PCT/CN2020/070784
Publication Date:
December 24, 2020
Filing Date:
January 08, 2020
Export Citation:
Assignee:
UNIV JIANGNAN (CN)
International Classes:
G16B25/00
Foreign References:
| CN110289049A | 2019-09-27 | |||
| CN108846255A | 2018-11-20 | |||
| CN105740245A | 2016-07-06 | |||
| CN107770783A | 2018-03-06 | |||
| CN103049678A | 2013-04-17 |
Other References:
LI, LI ET AL.: "Relationship between time-space structure pattern and thermal stability of lipase based on frequent item sets mining and successive frame difference", CHINESE JOURNAL OF BIOCHEMISTRY AND MOLECULAR BIOLOGY, no. 03, 31 March 2018 (2018-03-31), ISSN: 1007-7626, DOI: 20200325171230
Attorney, Agent or Firm:
HARBIN SHINEIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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