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Title:
METHOD AND APPARATUS FOR AUTOMATICALLY ADJUSTING THE CONTOUR OF A WAFER CARRIER SURFACE
Document Type and Number:
WIPO Patent Application WO/2000/069595
Kind Code:
A2
Abstract:
A method and apparatus is provided for holding a workpiece (111) in a carrier (100) parallel to a polishing pad (112) while pressing the workpiece (111) against the polishing pad (112) during a planarization process. The carrier's pressure plate (102) and/or backing film (103) are comprised of materials that allow the carrier (100) to adjust its local contours based on the removal rate of material from the workpiece (111) during the planarization process without the need for complicated mechanical devices. In addition, or alternatively, the retaining ring (105) may be comprised of materials that allow the retaining ring (105) to adjust its local contours due to the friction between the retaining ring (105) and the polishing pad (112) during the planarization process, thereby pre-loading and stretching the polishing pad (112) in an even and uniform manner resulting in a superior planarizaton process.

Inventors:
Meloni, Mark A. (701 West Grove Parkway Tempe, AZ, 85283, US)
Application Number:
PCT/US2000/013399
Publication Date:
November 23, 2000
Filing Date:
May 16, 2000
Export Citation:
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Assignee:
SPEEDFAM-IPEC CORPORATION (305 North 54th Street Chandler, AZ, 85226, US)
International Classes:
B24B41/06; B24B49/14; (IPC1-7): B24B/
Foreign References:
EP0857541A21998-08-12
JP2000061822A2000-02-29
US5769692A1998-06-23
US5885135A1999-03-23
EP0776730A11997-06-04
EP0988931A22000-03-29
Attorney, Agent or Firm:
Farmer, James L. (Speedfam-Ipec Corporation 305 North 54th Street Chandler, AZ, 85226, US)
Download PDF:
Claims:
Claims
1. A workpiece carrier for holding a workpiece parallel to a polishing pad while pressing the workpiece against the polishing pad during a planarization process, comprising: a housing assembly; and a pressure plate forming a bottom surface of said housing assembly, wherein said pressure plate is capable of automatically adjusting its contour based upon a removal rate of material from the workpiece.
2. A carrier as in claim 1 wherein said pressure plate comprises a material having a negative coefficient of thermal expansion.
3. A carrier as in claim 2 wherein said pressure plate comprises a rare earth ceramic.
4. A carrier as in claim I wherein said pressure plate comprises a cellular film wherein microscopic buckling of cells comprising said cellular film is reversible and temperature dependent.
5. A workpiece carrier for holding a workpiece parallel to a polishing pad while pressing the workpiece against the polishing pad during a planarization process, comprising: a housing assembly; a pressure plate forming a bottom surface of said housing assembly; and a backing film attached to said pressure plate, wherein said backing film is capable of automatically adjusting its contour based upon a removal rate of material from the workpiece.
6. A carrier as in claim 5 wherein the backing film comprises a polymer.
7. A carrier as in claim 6 wherein the backing film comprises a polyvinyl acetate.
8. A workpiece carrier for holding a workpiece parallel to a polishing pad while pressing the workpiece against the polishing pad during a planarization process, comprising: a housing assembly; a pressure plate forming a bottom face on said housing assembly; a backing film attached to said pressure plate, said backing film having increased compressibility near a periphery of said backing film with respect to a center of said backing film.
9. A workpiece carrier for holding a workpiece parallel to a polishing pad while pressing the workpiece against the polishing pad during a planarization process, comprising: a housing assembly; a pressure plate forming a bottom surface on said housing assembly; and a retaining ring functionally connected to said housing assembly, wherein said retaining ring is capable of automatically adjusting its contour based upon an amount of friction produced with respect to the polishing pad.
10. A carrier as in claim 9 wherein said retaining ring comprises a material with a negative coefficient of thermal expansion.
11. A carrier as in claim 10 wherein said retaining ring comprises a rare earth ceramic.
12. A carrier as in claim 9 wherein said retaining ring comprises a polymer.
13. A method for planarizing a workpiece, having a front and back surface, held in a carrier against a polishing surface moving relative to the workpiece, comprising the steps of : planarizing a front side of the workpiece; and automatically self adjusting localized pressure regions on the back surface of the workpiece in inverse relation to localized removal rates of material from the workpiece while the workpiece is being planarized.
Description:
INTERNATIONALSEARCHREPORT InternlaiApplicationNo PCT/US00/13399 C.(Continuation)DOCUMENTSCONSIDEREDTOBERELEVANT CategoryCitationofdocument,withindication,whereappropriate,o ftherelevantpassagesRelevanttoclaimNo. XUS5885135A(DESORCIEDANIELDET AL)8 23March1999(1999-03-23) column6,line10-line35;figure2 XEP0776730A(RODELNITTACOMPANY)9,12 4June1997(1997-06-04) page5,line29-line52;figure2 P,XEP0988931A(SPEEDFAMCOLTD)9,12 29March2000(2000-03-29) paragraph'0042! 2 INTERNATIONAL SEARCH REPORT Intern af ApplicationNo .Jrmationon patentfamily members PCT/US 00/13399 PatentdocumentPublication Patent family Publication citedinsearchreportdatemember(s)date EP0857541A12-08-1998JP10217112A18-08-1998 US6030488A29-02-2000 JP2000061822A29-02-2000NONE US5769692A23-06-1998NONE US5885135A23-03-1999JP3030276B10-04-2000 JP10315125A02-12-1998 EP0776730A04-06-1997JP9155730A17-06-1997 US5645474A08-07-1997 EP 0988931 A 29-03-2000 JP 2000084836 A 28-03-2000