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Title:
METHOD AND APPARATUS FOR AUTOMATICALLY ADJUSTING THE CONTOUR OF A WAFER CARRIER SURFACE
Document Type and Number:
WIPO Patent Application WO2000069595
Kind Code:
A3
Abstract:
A method and apparatus is provided for holding a workpiece (111) in a carrier (100) parallel to a polishing pad (112) while pressing the workpiece (111) against the polishing pad (112) during a planarization process. The carrier's pressure plate (102) and/or backing film (103) are comprised of materials that allow the carrier (100) to adjust its local contours based on the removal rate of material from the workpiece (111) during the planarization process without the need for complicated mechanical devices. In addition, or alternatively, the retaining ring (105) may be comprised of materials that allow the retaining ring (105) to adjust its local contours due to the friction between the retaining ring (105) and the polishing pad (112) during the planarization process, thereby pre-loading and stretching the polishing pad (112) in an even and uniform manner resulting in a superior planarizaton process.

Inventors:
MELONI MARK A
Application Number:
US0013399W
Publication Date:
February 01, 2001
Filing Date:
May 16, 2000
Export Citation:
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Assignee:
SPEEDFAM-IPEC CORPORATION
International Classes:
B24B41/06; B24B49/14; (IPC1-7): B24B37/04; B24B41/06; B24B49/14
Foreign References:
EP0857541A21998-08-12
JP2000061822A2000-02-29
US5769692A1998-06-23
US5885135A1999-03-23
EP0776730A11997-06-04
EP0988931A22000-03-29
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