Title:
METHOD AND APPARATUS FOR AUTOMATICALLY GENERATING PACKAGE BONDING PROGRAM, STORAGE MEDIUM, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/208595
Kind Code:
A1
Abstract:
A method and apparatus for automatically generating a package bonding program, a storage medium, and an electronic device. The method comprises: respectively obtaining the bonding point coordinate data of a chip to be bonded and a packaging frame; according to the bonding point coordinate data, obtaining the relevant constraint conditions of all pairs of bonding points, wherein the relevant constraint conditions comprise a vertical constraint height difference, a horizontal constraint distance, and a frame constraint height difference of each pair of bonding points; obtaining the bonding data of all pairs of bonding points according to the relevant constraint conditions, wherein the bonding data comprises the actual bonding height and inflection point coordinates of a bonding wire; and generating a bonding production program according to the bonding data. The present method can automatically generate package bonding data, and by combining different bonding apparatuses, automatically generates the package bonding program, thereby improving the working efficiency, and reducing the production cost.
Inventors:
LIU FENGSHOU (CN)
QIAN SHENGJIE (CN)
WU JIHONG (CN)
QIAN SHENGJIE (CN)
WU JIHONG (CN)
Application Number:
PCT/CN2021/077349
Publication Date:
October 21, 2021
Filing Date:
February 23, 2021
Export Citation:
Assignee:
VAYO SHANGHAI TECH CO LTD (CN)
International Classes:
G06F30/392
Foreign References:
| CN201673504U | 2010-12-15 | |||
| CN110197019A | 2019-09-03 | |||
| CN111651955A | 2020-09-11 | |||
| CN110414123A | 2019-11-05 | |||
| US20110057302A1 | 2011-03-10 |
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