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Title:
METHOD AND APPARATUS FOR CLEANING SUBSTRATES
Document Type and Number:
WIPO Patent Application WO/2019/153134
Kind Code:
A1
Abstract:
The present invention provides a method for cleaning substrates comprising the steps of: placing a substrate on a substrate holder; implementing a bubble less or bubble-free pre-wetting process for the substrate; and implementing an ultra/mega sonic cleaning process for cleaning the substrate.

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Inventors:
WANG HUI (CN)
WANG XI (CN)
CHEN FUPING (CN)
ZHANG XIAOYAN (CN)
CHEN FUFA (CN)
Application Number:
PCT/CN2018/075550
Publication Date:
August 15, 2019
Filing Date:
February 07, 2018
Export Citation:
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Assignee:
ACM RES SHANGHAI INC (CN)
International Classes:
H01L21/02
Domestic Patent References:
WO2016183811A12016-11-24
Foreign References:
US20120052204A12012-03-01
US5427622A1995-06-27
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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